Homepage Intel newsroom

New Intel Optical Transceivers Enable High-Density, Low-Power 10 Gigabit Communications Equipment

Announcement posted by Intel 07 Feb 2002

Intel Corporation has introduced two new optical networking subsystems that lower power consumption and increase the density of 10 Gigabit per second communications solutions for enterprise, metropolitan area and core telecom networks.

Known as optical transceivers or transponders, the Intel TXN13200 family and Intel TXN17401 combine high-speed electronic components with a miniature optical receiver and transmitter in a subsystem that can be placed at each 10 Gigabit per second port of an optical network.

The new optical transceivers expand our portfolio, allowing our customers to choose the right combination of cost, power, size and protocol, said Michael Ricci, vice president, Intel Communications Group and general manager, Optical Products Group. Were coupling Intels manufacturing expertise in microelectronics with our patented manufacturing process to deliver high-performance optical solutions on a mainstream scale. By integrating, Intel lowers costs and accelerates the deployment of 10 Gigabit optical networking.

With a footprint about the size of a credit card (3 x 2.2 inches), the TXN13200 targets telecom applications where high port density is of critical importance. Applications include multi-port 10 Gigabit line cards in routers, switches and cross-connects in metro and core networks, and the client side of DWDM terminals in the enterprise. The Intel TXN13200 comes in two versions, one for OC192 SONET/SDH and one for 10 Gigabit Ethernet networks, employing the two most common protocols in todays telecommunications equipment. The TXN13200 integrates the Intel LXT16784/85 Serialiser/Deserialiser and low jitter performance to produce excellent optical signal quality. The TXN13200 runs at just 6.5 watts maximum power consumption over the full operating temperature range, nearly 35 per cent less than other transceivers on the market.

The TXN13200 complies with 300-pin Multi-Source Agreement (MSA) standards, allowing a turnkey solution for customers. An MSA is an agreement among manufacturers that defines essential requirements for form factor, pin count, electrical connectors and protocol standards conformance. The MSAs serve as defacto standards between manufacturers, allowing rapid adoption of new technology.

The Intel TXN17401 supports 10 Gigabit Ethernet applications such as enterprise switches and routers and metropolitan area network equipment at a lower cost than SONET without sacrificing performance. This XENPAK MSA compliant subsystem features a 70-pin hot pluggable electrical interface and frontface pluggable optics that allow field installation and replacement of the optical module without replacing the whole line card.

Both of the transceivers can send data ten kilometers over single mode fiber optic cables as required by 10 Gigabit Ethernet standards. They also use uncooled laser technology, which takes up less space and consumes less power than traditional thermo-electric coolers. Intel advances in packaging, electronics design and materials have enabled these uncooled lasers to maintain the performance levels required by existing optical networking standards throughout the entire operating temperature range.

Intel optical transceivers are produced through an automated fiber alignment process rather than the manual techniques used by other optical module manufacturers. Intels optical manufacturing process results in greater production flexibility and allows the ability to include additional functions.

Pricing and Availability

The Intel TXN17401 will be priced below US$1000 in high volume. Pricing for the Intel TXN13200 will be less than US$2000 in high volume. Samples of both products are currently available.

About Intel

Intel, the worlds largest chipmaker, is also the leading manufacturer of computer, networking and communications products. Additional information about Intel is available at www.intel.com/pressroom.