Intel Executives Outlined Strategies For Next Generation Wired And Wireless Computing Networks And Platforms At Asia Pacific Developer Forum
Announcement posted by Intel 24 Apr 2001
During their keynotes at the Intel Developer Forum (IDF) today, Intel executives outlined the companys strategies to enable richer applications and services for next-generation wired and wireless computing networks and platforms.
The need for greater Internet bandwidth is being driven by the rapid growth of wireless devices, continued growth in wired Internet access, and the convergence of voice and data over next-generation networks. This explosion of digital data over the Internet creates a market opportunity for Intels communications silicon components.
The Intel Personal Internet Client Architecture (Intel PCA) will speed the transition to next-generation wireless clients. At IDF today, Intel demonstrated the worlds fastest digital signal processor (DSP) architecture for wireless handled devices. Called the Intel Micro Signal Architecture (MSA), the new design incorporates DSP and microcontroller functions onto a single chip. The MSA silicon is capable of operating at speeds of up to 400 MHz, more than twice as fast as other DSPs for wireless handheld devices.
Intel and Analog Devices (ADI) jointly developed the MSA and introduced the architecture last December. Under the joint development agreement, both companies are separately developing and marketing products based on this design. The MSA will be part of an integrated baseband chipset to be announced later this year for cell phones and other handheld devices.
Intel is a leading supplier of communications silicon technologies to the networking and wireless communications industries, and has the expertise and variety of products to successfully develop next-generation networks, said Ron Smith, senior vice president and general manager of Intels Wireless Computing and Communications Group. The Micro Signal Architecture is a key building block for the Intel Personal Internet Client Architecture, and is ideal for processing audio, video, image and voice in next-generation wireless Internet devices.
During his keynote, Smith also announced that twenty-six leading wireless device and equipment manufacturers, application developers and service providers from China, Korea and Taiwan today endorsed the Intel PCA, joining Intel in the efforts to accelerate the development of applications and hardware for next-generation wireless Internet devices.
Looking Ahead: Intel and the Future of Computing
Pat Gelsinger, vice president and chief technology officer of the Intel Architecture Group, showed Intels commitment in designing for the future US$4.3 billion in R&D, US$7.5 billion in capital spending, and world-class technology innovation from Intel Labs.
Research directions and innovations will focus on four areas: silicon and manufacturing, compelling platform architecture, communications, and new Internet capabilities. The efforts made in these areas will help fuel the future of computing.
For silicon and manufacturing, Gelsinger outlined the criteria and evolving technologies that will make Moores law work through 2010. For compelling platform architecture, Gelsinger highlighted Intels concept PC efforts, next-generation I/O architecture, and advances in compiler technology.
Intel Labs are working to define the future of the PC platform. This work includes innovative system packaging, power, and thermal solutions as well as promoting initiatives such as Ease of Use, Legacy Reduction and Instantly Available PC.
According to Gelsinger, the PC will continue to be at the centre of your digital universe and provide users with compelling experiences. The future is the Giga PC, where users will have no less than GHz processors, GHz bus, GB connectivity and GB storage right at their fingertips, Gelsinger said. .
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About IDF
The Intel Developer Forum is Intels premier technical forum featuring more than 250 sessions and hands-on labs, and numerous demonstrations of cutting-edge products and technologies. Now in its fourth year, the semi-annual conference provides hardware original equipment manufacturers, and independent hardware and software vendors with in-depth information on Intel technologies and initiatives. Visit http://developer.intel.com/idf for more information. Subscribe to the Intel Developer Update Magazine at http://developer.intel.com/update/ for updated information throughout the year.
Intel, the worlds largest chip maker, is also a leading manufacturer of computer, networking and communications products. Additional information about Intel is available at
www.intel.com/pressroom.
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The need for greater Internet bandwidth is being driven by the rapid growth of wireless devices, continued growth in wired Internet access, and the convergence of voice and data over next-generation networks. This explosion of digital data over the Internet creates a market opportunity for Intels communications silicon components.
The Intel Personal Internet Client Architecture (Intel PCA) will speed the transition to next-generation wireless clients. At IDF today, Intel demonstrated the worlds fastest digital signal processor (DSP) architecture for wireless handled devices. Called the Intel Micro Signal Architecture (MSA), the new design incorporates DSP and microcontroller functions onto a single chip. The MSA silicon is capable of operating at speeds of up to 400 MHz, more than twice as fast as other DSPs for wireless handheld devices.
Intel and Analog Devices (ADI) jointly developed the MSA and introduced the architecture last December. Under the joint development agreement, both companies are separately developing and marketing products based on this design. The MSA will be part of an integrated baseband chipset to be announced later this year for cell phones and other handheld devices.
Intel is a leading supplier of communications silicon technologies to the networking and wireless communications industries, and has the expertise and variety of products to successfully develop next-generation networks, said Ron Smith, senior vice president and general manager of Intels Wireless Computing and Communications Group. The Micro Signal Architecture is a key building block for the Intel Personal Internet Client Architecture, and is ideal for processing audio, video, image and voice in next-generation wireless Internet devices.
During his keynote, Smith also announced that twenty-six leading wireless device and equipment manufacturers, application developers and service providers from China, Korea and Taiwan today endorsed the Intel PCA, joining Intel in the efforts to accelerate the development of applications and hardware for next-generation wireless Internet devices.
Looking Ahead: Intel and the Future of Computing
Pat Gelsinger, vice president and chief technology officer of the Intel Architecture Group, showed Intels commitment in designing for the future US$4.3 billion in R&D, US$7.5 billion in capital spending, and world-class technology innovation from Intel Labs.
Research directions and innovations will focus on four areas: silicon and manufacturing, compelling platform architecture, communications, and new Internet capabilities. The efforts made in these areas will help fuel the future of computing.
For silicon and manufacturing, Gelsinger outlined the criteria and evolving technologies that will make Moores law work through 2010. For compelling platform architecture, Gelsinger highlighted Intels concept PC efforts, next-generation I/O architecture, and advances in compiler technology.
Intel Labs are working to define the future of the PC platform. This work includes innovative system packaging, power, and thermal solutions as well as promoting initiatives such as Ease of Use, Legacy Reduction and Instantly Available PC.
According to Gelsinger, the PC will continue to be at the centre of your digital universe and provide users with compelling experiences. The future is the Giga PC, where users will have no less than GHz processors, GHz bus, GB connectivity and GB storage right at their fingertips, Gelsinger said. .
-Ends-
About IDF
The Intel Developer Forum is Intels premier technical forum featuring more than 250 sessions and hands-on labs, and numerous demonstrations of cutting-edge products and technologies. Now in its fourth year, the semi-annual conference provides hardware original equipment manufacturers, and independent hardware and software vendors with in-depth information on Intel technologies and initiatives. Visit http://developer.intel.com/idf for more information. Subscribe to the Intel Developer Update Magazine at http://developer.intel.com/update/ for updated information throughout the year.
Intel, the worlds largest chip maker, is also a leading manufacturer of computer, networking and communications products. Additional information about Intel is available at
www.intel.com/pressroom.
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