INTEL INTRODUCES WORLDS FIRST NOR FLASH MEMORY ON 90-NANOMETRE MANUFACTURING TECHNOLOGY
Announcement posted by Intel 21 Feb 2004
The worlds first NOR flash memory device on 90-nanometre (nm) manufacturing technology was announced today by Intel Corporation. Intel Wireless Flash Memory is the companys ninth generation of flash memory technology and will retain the high performance features of flash memory needed by wireless handset makers.
In a keynote address at the Intel Developer Forum, Intel Executive Vice President Sean Maloney explained that Intel Wireless Flash Memory manufactured on 90 nm (a nanometre is one-billionth of a metre) process technology has an approximately 50 percent smaller die size compared to the previous generation, which will lower costs and double Intel manufacturing capability to meet the needs of customers. The first flash memory product will be a single-bit-per-cell device, with devices available later this year on Intels multi-level cell (MLC) technology, which holds twice the amount of information in one cell.
Intel Wireless Flash Memory is the highest performance solution available today for wireless applications, said Tom Lacey, vice president, Intel Flash Products Group. It combines four innovations into one product: low 1.8V operation, direct code execution (execute-in-place), enhanced factory programming and dual code and data storage in one chip. All four are important features which enable our wireless customers to develop reliable state-of-the-art devices.
Intel Wireless Flash Memory on 90 nm process technology is the latest member of the Intel Stacked Chip Scale Packaging (Stacked-CSP) product line. By offering a common package pin out and Intel flash software solutions across a range of densities, stacked flash memory integration and upgrades are easily made and enable device designers to pack more memory into less space. Intel combines its high-density flash memory products with flexible RAM options to offer densities up to 1 Gb in a small package size of 8 mm x11 mm.
With more than 18 years of flash memory industry experience, Intel continues to be a leader in NOR flash memory. Intel is a leading supplier of flash memory to the wireless market segment and also provides solutions for other applications including consumer electronics and communications devices.
Pricing and Availability
Intel Wireless Flash Memory based on 90 nm process technology will sample in April in densities of 64Mb. Volume production is planned for the third quarter of this year, with a suggested price of $10.26 in 10,000-unit quantities. Intel plans to sample MLC Intel StrataFlash Wireless Memory on 90nm later this year. These MLC devices will include 256 Mb and 512 Mb discrete densities and will offer various stacked configurations.
About IDF
The Intel Developer Forum is the technology industry's premier event for hardware and software developers. Held worldwide throughout the year, IDF brings together key industry players to discuss cutting-edge technology and products for PCs, servers, communications equipment, and handheld clients. For more information on IDF and Intel technology, visit http://developer.intel.com.
About Intel Corporation
Intel, the worlds largest chip maker, is also a leading manufacturer of computer, networking and communications products. Additional information about Intel is available at www.intel.com/pressroom.
-ENDS-
Intel, Intel StrataFlash and Intel Wireless Flash are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and other countries.
*Other names and brands may be claimed as the property of others.
In a keynote address at the Intel Developer Forum, Intel Executive Vice President Sean Maloney explained that Intel Wireless Flash Memory manufactured on 90 nm (a nanometre is one-billionth of a metre) process technology has an approximately 50 percent smaller die size compared to the previous generation, which will lower costs and double Intel manufacturing capability to meet the needs of customers. The first flash memory product will be a single-bit-per-cell device, with devices available later this year on Intels multi-level cell (MLC) technology, which holds twice the amount of information in one cell.
Intel Wireless Flash Memory is the highest performance solution available today for wireless applications, said Tom Lacey, vice president, Intel Flash Products Group. It combines four innovations into one product: low 1.8V operation, direct code execution (execute-in-place), enhanced factory programming and dual code and data storage in one chip. All four are important features which enable our wireless customers to develop reliable state-of-the-art devices.
Intel Wireless Flash Memory on 90 nm process technology is the latest member of the Intel Stacked Chip Scale Packaging (Stacked-CSP) product line. By offering a common package pin out and Intel flash software solutions across a range of densities, stacked flash memory integration and upgrades are easily made and enable device designers to pack more memory into less space. Intel combines its high-density flash memory products with flexible RAM options to offer densities up to 1 Gb in a small package size of 8 mm x11 mm.
With more than 18 years of flash memory industry experience, Intel continues to be a leader in NOR flash memory. Intel is a leading supplier of flash memory to the wireless market segment and also provides solutions for other applications including consumer electronics and communications devices.
Pricing and Availability
Intel Wireless Flash Memory based on 90 nm process technology will sample in April in densities of 64Mb. Volume production is planned for the third quarter of this year, with a suggested price of $10.26 in 10,000-unit quantities. Intel plans to sample MLC Intel StrataFlash Wireless Memory on 90nm later this year. These MLC devices will include 256 Mb and 512 Mb discrete densities and will offer various stacked configurations.
About IDF
The Intel Developer Forum is the technology industry's premier event for hardware and software developers. Held worldwide throughout the year, IDF brings together key industry players to discuss cutting-edge technology and products for PCs, servers, communications equipment, and handheld clients. For more information on IDF and Intel technology, visit http://developer.intel.com.
About Intel Corporation
Intel, the worlds largest chip maker, is also a leading manufacturer of computer, networking and communications products. Additional information about Intel is available at www.intel.com/pressroom.
-ENDS-
Intel, Intel StrataFlash and Intel Wireless Flash are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and other countries.
*Other names and brands may be claimed as the property of others.